FAZE Electronics
Hot Plate
The Hot Plate is used for soldering SMD component populated PCB's. Time to
solder a PCB is quick, (depending on method , PCB thickness and size).
The top display shows the set point. This is changed by typing STAR X X X on
the keypad. The bottom display indicates the actual temperature. The three bars
on the left indicates that the element is switched on and the plate is heaing up.
The Hash key shows OFF
when pressed and the Hot Plate is switched off
To switch on again, press the HASH key.
Note that only SMD components on one side of the PCB can be soldered this way.
See the Hot Plate in action HERE
This will be the third step in finishing your SMD PCB's.
(It started here)
A simple but highly efficient solution to soldering SMD components on PCB's. When
you place the PCB on the hot surface, heat is from below and transferred directly to the PCB.
The PCB thus acts as a heat shield between the heated surface and the components, thus
no pre-heating of the components are nessesary. But because Heat is transferred directly
from the heated surface to the PCB itself, soldering time is greatly reduced.
The temperature you solder at 60 to 80 deg Celcius lower than with conventional
reflow equipment. When the temperature is set correctly, even extended time on
the hot plate does not overheat the components and the PCB's does not burn brown.
Limited heat is transferred and radiated directly to the components. Small components
does not exceed the maximum set temperature as is the case with overhead heated
reflow equipment.
Another advantage is that you can easily correct any misaligned or tomb stoning components.
Disadvantage is that it is still a manual process – in some way can be compensated for if
the time to "stack solder" boards is taken into account. (place PCB's 1,2,3,4,5 -
remove 1, re-place 1, remove 2, re-place 2 etc.) You end up soldering a PCB every
3 to 5 seconds ! but this depends on the size of the PCB and the components
Large PCB's tend to lift their sides from the hot surface, but when the PCB reaches
a uniform temperature the PCB relaxes and the sides sags down. The PCB's does
not bend or twist when taken off the Hot Plate to cool down.
When all the solder joints are melted, the PCB can be removed to cool down.
Please use a small long-nose plier to remove the PCB's from the Hot Plate.
It does not look it, but it's really hot. It is suitable to place the hot PCB's on
cardboard (paper box) or hardboard (wood) to cool down.
After cooled down sufficiently to handle, you can now place the PCB's in
our PCB Tray's for inspection, washing, testing and storage.
You have now successfully completed your SMD PCB's!
Leaded or lead-free
solder can
be used.
(Not for food processing.)
Supply 230VAC, Element 1000W, embedded in the alluminium for minimum
energy loss, supply current 4A.
Solder surface material alluminium 200mm x 300mm
Temperature sensing Thermocouple Type K (Chromel vs. Alumel),
Control Micro Processor
Accuracy +/- 1º C, recommended temperature 180 º C
Setpoint and relative temperature indication ,
Rating Continuous
Guarantee: One Year, excl. i.e. acts of God
FAZE Electronics Design & Manufacture Commercial and Industrial Electronics
Phone +27 12 661 4751
Fax +27 12 661 9949
Mobile 082 456 6925